Tools: Difference between revisions

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* [[E-line|Raith E-Line Electron Beam Lithography Tool]]
* [[E-line|Raith E-Line Electron Beam Lithography Tool]]
* [[Temescal Electron-beam Evaporator|Temescal Electron-beam Evaporator]]
* [[AFM|Jupiter AFM Oxford Instruments-Asylumn Research]]
* [[Temescal Electron-beam Evaporator|Temescal FC200]]
* [[Plasmatherm 790Plus|Plasmatherm 790 Plus Reactive-ion Etcher]]
* [[Plasmatherm 790Plus|Plasmatherm 790 Plus Reactive-ion Etcher]]
* [[Cleanroom|ISO-class 5 cleanroom]]
* [[Cleanroom|ISO-class 5 cleanroom]]
* [[Fumehood Cleanroom|Cleanroom Fumehood]]
* [[Fumehood Cleanroom|Cleanroom Fumehood]]
* [[Fumehood Outerlab|Outerlab Fumehood]]
* [[Fumehood Outerlab|Outerlab Fumehood]]
* [[Spinner|SPI Spin Coater]]
* [[Spinner|Laurell WS-400BX-6NPP/Lite]]
* [[Wafer Hotplate|Wafer Hotplate]]
* [[Wafer Hotplate|Wafer Hotplate]]
* [[Sputter Coater|Sputter Coater (Gold Palladium Target)]]
* [[Sputter Coater|Emitec SC7620 Mini Sputter Coater (Gold Palladium Target)]]
* [[Spectrometer|Filmetrics Transmission and Reflection Spectrometer for thin-film characterization]]
* [[Spectrometer|Filmetrics Transmission and Reflection Spectrometer for thin-film characterization]]





Revision as of 06:26, 17 November 2023