Main Page: Difference between revisions
No edit summary |
No edit summary |
||
| Line 5: | Line 5: | ||
We use this WikiMedia site for documentation of all equipment, facilities and standard operating procedures of the laboratory. As a registered user of the laboratory you will receive permission to log into this site, which will allow you to contribute to the documentation and give information on the processes particular to your project. | We use this WikiMedia site for documentation of all equipment, facilities and standard operating procedures of the laboratory. As a registered user of the laboratory you will receive permission to log into this site, which will allow you to contribute to the documentation and give information on the processes particular to your project. | ||
== Equipment == | == Equipment and Standard Operating Procedures (SOPs)== | ||
* Electron-beam lithography: Raith e-Line | * Electron-beam lithography: Raith e-Line | ||
| Line 16: | Line 16: | ||
* Electron-beam evaporator: Temescal FC-2000 | * Electron-beam evaporator: Temescal FC-2000 | ||
* UV-lithography setup | |||
* Spin-coater | |||
* Convection Oven | |||
* Hotplates | |||
* Ultrasonic Bath | |||
* | |||
* old link: [[Procedures|Standard Operating Procedures]] | |||
* | == Facilities == | ||
* | |||
== Laboratory Documents == | == Laboratory Documents == | ||
| Line 29: | Line 41: | ||
* [[Safety|Safety Guidelines and Information]] | * [[Safety|Safety Guidelines and Information]] | ||
* [[Cleaning|Lab Cleaning Procedures]] | * [[Cleaning|Lab Cleaning Procedures]] | ||
* [[Consumables|Available consumables and supplier information]] | |||
== People == | == People == | ||
| Line 41: | Line 54: | ||
* [[Thomas3|Thomas Håvardstun]] | * [[Thomas3|Thomas Håvardstun]] | ||
* [[Jarand|Jarand Gauteplass]] | * [[Jarand|Jarand Gauteplass]] | ||
== Further Information == | |||
Revision as of 13:00, 20 March 2012
Wiki for UiB's NanoStructures Laboratory.
UiB's NanoStructures laboratory is equipped with modern thin-film processing and lithography equipment. The lab is built around an electron-beam lithography tool (Raith e-Line) which can be used to pattern resist thin-films with minimal structure sizes of the order of 10 nanometer. The resist layers can be used to transfer the pattern into other thin-films that are either deposited using an electron-beam evaporator (Temescal FC-2000) or a spin-coater. For the pattern transfer a reactive-ion etcher (RIE, Plasmatherm 790+) is available as well as a wet-bench fumehood to perform wet-etch and lift-off processes. An improvised UV-exposure setup is available for crude patterning.
We use this WikiMedia site for documentation of all equipment, facilities and standard operating procedures of the laboratory. As a registered user of the laboratory you will receive permission to log into this site, which will allow you to contribute to the documentation and give information on the processes particular to your project.
Equipment and Standard Operating Procedures (SOPs)
- Electron-beam lithography: Raith e-Line
- Reactive-ion etcher: Plasmatherm 790+
- Electron-beam evaporator: Temescal FC-2000
- UV-lithography setup
- Spin-coater
- Convection Oven
- Hotplates
- Ultrasonic Bath
- old link: Standard Operating Procedures
Facilities
Laboratory Documents
- Available fabrication tools and facilities
- Laboratory Code of Conduct / Clothing rules
- Safety Guidelines and Information
- Lab Cleaning Procedures
- Available consumables and supplier information
People
- Bodil Holst
- Bjørn Samelin
- Thomas Reisinger
- Xiaodong Guo
- Martin Greve
- Rachid Maad
- Thomas Bolstad
- Thomas Håvardstun
- Jarand Gauteplass
Further Information
Information on using MediaWiki
Consult the User's Guide for information on using the wiki software.